Metsä Board will be exhibiting its specially engineered paperboards and services to co-create future-ready packaging at the Interpack packaging fair (hall 8a/D49) in Düsseldorf starting on the 4th of May.
Visitors will have the opportunity to take part in daily packaging design workshops featuring expert talks and case studies, all aimed at supporting packaging circularity, carbon footprint reduction and resource efficiency. They can also bring their own challenges to our team of experts and get answers to their burning questions.
The ‘Future-ready packaging’ workshops will take place in the Design Lab area of Metsä Board’s stand every day at 11.30 am. At each workshop, the following topics will be covered:
- Boosting innovation with the Excellence Centre through the unique co-creation workshop concept
- Design better consumer experiences with less environmental impact - Case study: Biscuit packaging
- Reduce overpacking and lightweight packaging by simulating performance through the logistic chain
- Calculating environmental impacts of packaging
